Surface micromachined mechanisms and micromotors

Electric micromotors are sub-millimeter sized actuators capable of unrestrained motion in at least one degree of freedom. Polysilicon surface micromachining using heavily phosphorus-doped LPCVD polysilicon for the structural material, LPCVD silicon nitride for the electrical isolation and deposited silicon dioxide for the sacrificial material has formed the fabrication technology base for the development of these micromotors. Two polysilicon surface micromachining processes, referred to here as the center-pin and flange, have been demonstrated for the fabrication of passive mechanisms and micromotors. Passive mechanisms such as gear trains, cranks and manipulators have been implemented on silicon. Reported operational micromotors have been of the rotary variable-capacitance salient-pole and harmonic (or wobble) side-drive designs. These micromotors are capable of motive torques in the 10 pN m order of magnitude range. Preliminary progress has been made in studying the operational, friction and wear characteristics of these micromechanical devices. Typical operational voltages have been as low as 37 V and 26 V across 1.5 mu m air gap salient-pole and harmonic micromotors. These excitations correspond to electric field intensities above 10(8) Vm-1 in the micromotor air gaps. Salient-pole and wobble micromotors have been reported to operate at speeds as high as 15000 rpm and 700 rpm, respectively. Micromotor lifetimes of at least many millions of cycles over a period of several days have been reported

Microfabricated Ice-Detection Sensor

Knowledge of ice conditions on important aircraft lift and control surfaces is critical for safe operation. These conditions can be determined with conventional ice-detection sensors, but these sensors are often expensive, require elaborate installation procedures, and interrupt the airflow. A micromachined, silicon-based, flush-mounted sensor which generates no internal heat has been designed, batch fabricated, packaged, and tested. The sensor is capable of distinguishing between an ice-covered and a clean surface. It employs a bulk micromachined wafer with a 7 micrometer-thick, boron-doped, silicon diaphragm which serves as one plate of a parallel-plate capacitor. This is bonded to a second silicon wafer which contains the fixed electrodes, one to drive the diaphragm by application of a voltage, the other to measure the deflection by a change in capacitance. The diaphragm sizes ranged from 1x1 mm to 3x3 mm, and the gap between parallel-plate capacitors is 2 micrometers. A 200 V d.c. was applied to the driving electrode which caused the capacitance to increase approximately 0.6pf, from a nominal capacitance of 0.6pf, when the surface was ice free. After the sensor was cooled below the freezing point of water, the same voltage range was applied to the drive electrode. The capacitance increased by the same amount. Then a drop of water was placed over the diaphragm and allowed to freeze. This created an approximately 2mm-thick ice layer. The applied 200V d.c. produced no change in capacitance, confirming that the diaphragm was locked to the ice layer. Since the sensor uses capacitive actuation, it uses very little power and is an ideal candidate for inclusion in a wireless sensing system

Silicon carbide and other films and method of deposition

A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties

Composition Comprising Silicon Carbide

A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties

Personal Navigation via High-Resolution Gait-Corrected Inertial Measurement Units

In this paper, a personal micronavigation system that uses high-resolution gait-corrected inertial measurement units is presented. The goal of this paper is to develop a navigation system that uses secondary inertial variables, such as velocity, to enable long-term precise navigation in the absence of Global Positioning System (GPS) and beacon signals. In this scheme, measured zerovelocity duration from the ground reaction sensors is used to reset the accumulated integration errors from accelerometers and gyroscopes in position calculation. With the described system, an average position error of 4 m is achieved at the end of half-hour walks

Personal Navigation via High-Resolution Gait-Corrected Inertial Measurement Units

In this paper, a personal micronavigation system that uses high-resolution gait-corrected inertial measurement units is presented. The goal of this paper is to develop a navigation system that uses secondary inertial variables, such as velocity, to enable long-term precise navigation in the absence of Global Positioning System (GPS) and beacon signals. In this scheme, measured zerovelocity duration from the ground reaction sensors is used to reset the accumulated integration errors from accelerometers and gyroscopes in position calculation. With the described system, an average position error of 4 m is achieved at the end of half-hour walks

Microfabricated silicon electric mechanisms

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.Includes bibliographical references (leaves 151-156).by Mehran Mehregany.Ph.D

Application of micromachined structures to the study of mechanical properties and adhesion of thin films

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1986.MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERINGBibliography: leaves 131-141.by Mehran Mehregany.M.S

Evolution of the Hilton Head Workshop research community

In this paper, we analyze the evolution of the Hilton Head Workshop research community using our new “sliding window” approach to network theory. To do so, we follow the Hilton Head Workshop from its inception, i.e., the first meeting in 1984, through 2004, the latest meeting. The Hilton Head Workshop research community and the field it represents have undergone many changes over the last 20 years, during which over 2000 researchers (i.e., paper authors) have published over 730 papers. Because the Workshop’s inception date coincides closely with the emergence of MEMS as a distinct field and the Workshop’s coverage is quite focused on MEMS, its evolution over the last 20 years provides insight into the evolution of the MEMS research community, particularly in North America. We find that the community has grown significantly since 1984, although it needs more time to become a fully “mature ” community. Our analysis shows that the sliding window approach paints an accurate and realistic picture of the Hilton Head research community